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      您現(xiàn)在的位置： 德承（深圳）科技有限公司>>強固型嵌入式電腦>>*性能可擴展型 (DS系列)>> DS-1200強固型嵌入式電腦
      
  
      
      
      
          
      
              
              
      
                    
        
                      
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      DS-1200強固型嵌入式電腦
      
       	
            
			
      
                				    
      
					
      
						
                                                   
      
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                                    強固型嵌入式電腦
      
                                  
                  
      
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            DS-1200第9/8代Intel® Core™處理器，高性能、擴展型和模塊化的強固型嵌入式系統(tǒng)產(chǎn)品特點支持第9/8代Intel® Core™  / Pentium® / Celeron® 8 Cores 35W/65W處理器（LGA 1151） 2個DDR4 SO-DIMM內(nèi)存插槽，支持 2666MHz 64GB 三重獨立顯示：1個 DVI-I 和2個 DP（4K 分辨率） 1個M.2 2280......
            
      
                            
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       德承DS-1200是一款高性能的無風(fēng)扇嵌入式計算機，采用第9/8代Intel®Core™平臺(Coffee Lake-R/S)，提供多達6個核心來滿足各種計算需求。DS-1200提供豐富的I/O，如1個PS/2、1個音頻輸入輸出、2個RS-232/422/485串口、2個Intel®GbE網(wǎng)口、2個USB 3.1 (Gen2)、4個USB 3.0、2個USB 2.0并具備三重獨立顯示。在內(nèi)存和存儲方面，DS-1200可配備多達32GB的DDR4-2666 SO-DIMM內(nèi)存，2個2.5寸SATA III硬盤，3個mSATA SSD和1個M.2 2280 NVMe SSD，滿足高性能存儲需求。
       
       基于德承*的CMI和CFM技術(shù)，用戶可使用各種現(xiàn)成的模塊根據(jù)自己的具體需求來配置系統(tǒng)。DS-1200是一款堅固耐用的嵌入式系統(tǒng)，具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，抗沖擊和振動能力強，高標(biāo)準(zhǔn)的工業(yè)保護，具有超級電容可免維護長效運行等特點。該系統(tǒng)適用于工廠自動化、機器視覺、車載計算和移動監(jiān)控等惡劣環(huán)境下的應(yīng)用。
      詳細規(guī)格
      Model NameDS-1200
      SystemProcessor? 9th Generation Intel® Coffee Lake-R S Series CPU:
        - Intel® Core™ i7-9700E 8 Cores Up to 4.4 GHz, TDP 65W
        - Intel® Core™ i5-9500E 6 Cores Up to 4.2 GHz, TDP 65W
        - Intel® Core™ i3-9100E 4 Cores Up to 3.7 GHz, TDP 65W
        - Intel® Core™ i7-9700TE 8 Cores Up to 3.8 GHz, TDP 35W
        - Intel® Core™ i5-9500TE 6 Cores Up to 3.6 GHz, TDP 35W
        - Intel® Core™ i3-9100TE 4 Cores Up to 3.2 GHz, TDP 35W
       ? 8th Generation Intel® Coffee Lake S Series CPU:
        - Intel® Core™ i7-8700 6 Cores Up to 4.6 GHz - 12M Cache, TDP 65W
        - Intel® Core™ i5-8500 6 Cores Up to 4.1 GHz - 9M Cache, TDP 65W
        - Intel® Core™ i3-8100 4 Cores 3.6 GHz - 6M Cache, TDP 65W
        - Intel® Core™ i7-8700T 6 Cores Up to 4.0 GHz - 12M Cache, TDP 35W
        - Intel® Core™ i5-8500T 6 Cores Up to 3.5 GHz - 9M Cache, TDP 35W
        - Intel® Core™ i3-8100T 4 Cores 3.1 GHz - 6M Cache, TDP 35W
        - Intel® Pentium® G5400 2 Cores 3.7 GHz - 4M Cache, TDP 58W
        - Intel® Pentium® G5400T 2 Cores 3.1 GHz - 4M Cache, TDP 35W
        - Intel® Celeron® G4900 2 Cores 3.1 GHz - 2M Cache, TDP 54W
        - Intel® Celeron® G4900T 2 Cores 2.9 GHz - 2M Cache, TDP 35W
      ChipsetIntel Q370
      Memory2x DDR4-2400/2666 MHz SO-DIMM Sockets, Supports up to 64 GB (Un-buffered and Non-ECC Type)
      Graphics? Integrated Intel® UHD Graphics 630: Core™ i7/i5/i3
       ? Integrated Intel® UHD Graphics 610: Pentium® /Celeron®
       ? Supports Triple Independent Display (1x DVI-I, 2x DisplayPort)
      AudioRealtek® ALC888, High Definition Audio
      BIOSAMI 32MB SPI BIOS
      I/O InterfaceDVI1x DVI-I (DVI-D: 1920 x 1200 @60Hz / VGA: 1920 x 1080 @60Hz)
      DP2x DisplayPort (DisplayPort: 4096 x 2304 @60Hz)
      LAN2x GbE LAN (Supports WoL, Teaming, Jumbo Frame & PXE), RJ45
          - GbE1: Intel® I210
          - GbE2: Intel® I219-LM
       Optional CMI Module
          - 4x RJ45 GbE LAN Module 
          - 4x M12 GbE LAN Module 
      PoE+Optional CMI & CFM Module
          - 4x PoE+, Individual port 25.5W, RJ45 Port
          - 4x PoE+, Individual port 25.5W, M12 Port
      Serial Port2x RS-232/422/485, DB9
       Optional CMI Module
          - 4x Isolated COM Module 
          - 4x COM Module
             * Supports RS-232/422/485 with Auto Flow Control, 5V/12V, DB9
      USB2x USB 3.1 Gen2 (Type A)
       4x USB 3.0 (Type A)
       2x USB 2.0 (Type A)
      PS/2 Port1x PS/2, 6-pin mini-DIN Female Connector
      Isolated DIOOptional CMI Module
          - 16x Optical Isolated DIO Module (8 in/8 out)
      Line-Out1x Line-Out, Phone Jack 3.5mm
      Mic-In1x Mic-In, Phone Jack 3.5mm
      Power Button1x ATX Power On/Off Button
      AT/ATX Switch1x AT/ATX Mode Switch
      Clear CMOS Switch1x Clear CMOS Switch
      Remote Power On/Off Connector1x Remote Power On/Off Connector, 2-pin Terminal Block
      Remote Reset Connector1x Remote Reset Connector, 2-pin Terminal Block
      External FAN Connector1x External FAN Connector, 4-pin Terminal Block
      StorageSSD/HDD? 2x 2.5" SATA HDD/SSD bay (Gen3), 1x Internal, 1x Front Accessable
       ? Supports RAID 0/1
      M.21x M.2 Key M 2280 Socket, Supports PCIe x4 NVMe SSD or SATA SSD (Gen3)
      mSATA3x mSATA (shared by Mini-PCIe socket) (Gen3), BIOS Selectable
      ExpansionCFM (Control Function Module) Interface1x CFM (Control Function Module) Interface
      CMI (Combined Multiple I/O) Interface2x CMI (Combined Multiple I/O) High Speed Interface
       2x CMI (Combined Multiple I/O) Low Speed Interface
      Mini PCI Express
      3x Full-size Mini-PCIe Socket
      Universal I/O Bracket4x Universal I/O Bracket
      SIM Socket2x SIM Socket
      Antenna Holes2x Antenna Holes
      OtherInstant RebootSupport 0.2sec
      Super CapSuperCap Integrated for CMOS Battery Maintenance-free Operation
      Watchdog TimerSoftware Programmable Supports 256 Levels System Reset
      Power RequirementPower TypeAT/ATX
      Power Input Voltage9~48VDC
      Connector3-pin Terminal Block
      Power AdapterOptional AC/DC Adapter
         - AC/DC 24V/5A, 120W
         - AC/DC 24V/9.2A, 220W
      PhysicalDimension (WxDxH)227 x 261 x 88 mm
      Weight Information4.92 kg
      Mechanical ConstructionExtruded Aluminum with Heavy Duty Metal
      MountingWall
      Unibody DesignYes
      Fanless DesignYes
      Jumper-less DesignYes
      ProtectionReverse Power Input ProtectionYes
      Over Voltage ProtectionProtection Range: 51~58V
       ?Protection Type: shut down operating voltage, re-power on at the preset level to recover
      Over Current Protection15A
      ESD Protection+/-8kV (air), +/-4kV (contact)
      Surge3.84 kV (impedance 12 ohm 1.2/50us waveform)
      Operating SystemWindowsWindows® 10
      LinuxSupports by project
      EnvironmentOperating Temperature? 35W TDP Processor: -40°C to 70°C
       ? 51~65W TDP Processor: -40°C to 45°C
        * PassMark BurnInTest: 99% CPU, 2D/3D Graphics (without thermal throttling)
        * With extended temperature peripherals; Ambient with air flow
        * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
      Storage Temperature-40°C to 85°C
      Relative Humidity95%RH @ 70°C (non-Condensing)
      ShockOperating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
      VibrationOperating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)
      MTBF396,565 Hours
      CertificationEMCCE,  FCC Class A, EN50121-3-2
      SafetyLVD EN62368-1
      
            
      
        
      
        
      
      
      
      
    
      
  
      
  
      
        
      

		 







  
    
    				
			 
    
    

    

     
      
     
	 

 	
	
	


      
	
      
		
      
			
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