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      您現(xiàn)在的位置： 德承（深圳）科技有限公司>>強(qiáng)固型嵌入式電腦>>*性能可擴(kuò)展型 (DS系列)>> DS-1102強(qiáng)固型嵌入式電腦
      
  
      
      
      
          
      
              
              
      
                    
        
                      
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      DS-1102強(qiáng)固型嵌入式電腦
      
       	
            
			
      
                				    
      
					
      
						
                                                   
      
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                                    強(qiáng)固型嵌入式電腦
      
                                  
                  
      
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            DS-1102第7/6代Intel® Core™ i3 / i5 / i7 處理器， 高性能，擴(kuò)展型和模塊化的強(qiáng)固型嵌入式系統(tǒng)，帶2個(gè)PCI/PCIe 擴(kuò)展槽產(chǎn)品特點(diǎn)支持第7/6代Intel® Xeon®和Core™  i3 / i5 / i7 處理器（LGA1151） 2個(gè)DDR4 SO-DIMM 內(nèi)存插槽，支持2133MHz 64 GB 三重獨(dú)立顯示 （1個(gè)DVI-I, 2個(gè)DP） 1個(gè)2.5......
            
      
                            
      產(chǎn)品介紹
      
            
      
              
       德承DS-1102是一款高性能的無(wú)風(fēng)扇嵌入式計(jì)算機(jī)，采用7/6代Intel®Core™平臺(tái)，支持多種臺(tái)式機(jī)CPU（LGA1151） ，支持兩個(gè)DDR4內(nèi)存插槽，可達(dá)64GB，使DS-1102能夠滿足各種計(jì)算需求。DS-1102具有豐富的I/O接口、串口供電、電隔離串口、光隔離數(shù)字I/O、多網(wǎng)口、網(wǎng)口供電（POE）、M12接口、RAID 0/1、智能點(diǎn)火控制和0.2秒即時(shí)重啟等功能。
       
       由于德承的CMI和CFM技術(shù)，您可根據(jù)具體需要使用我們現(xiàn)成的模塊配置專屬的DS-1102。此外，還支持2個(gè)PCI/PCIe擴(kuò)展槽，具有不同的接口組合，用于擴(kuò)展各種應(yīng)用的擴(kuò)展卡。DS-1102是一款堅(jiān)固耐用的嵌入式系統(tǒng)，具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強(qiáng)（5G/50G），高標(biāo)準(zhǔn)的工業(yè)保護(hù)，具有超級(jí)電容可免維護(hù)長(zhǎng)效運(yùn)行等特點(diǎn)。DS-1102適用于惡劣環(huán)境和關(guān)鍵應(yīng)用場(chǎng)合的部署，無(wú)需現(xiàn)場(chǎng)人員的維護(hù)。
      詳細(xì)規(guī)格
      Model NameDS-1102
      SystemProcessor? 7th Generation Intel® CPU (Kaby Lake-S)
       - Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP)
       - Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP)
       - Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP)
       - Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP)
       - Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP)
       - Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP)
       - Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP)
       ? 6th Generation Intel® CPU (Skylake-S)
       - Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP)
       - Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP)
       - Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP)
       - Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP)
       - Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP)
       - Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP)
       - Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP)
       - Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP)
       - Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP)
       - Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP)
      ChipsetIntel Q170
      Memory2x DDR4 2133 MHz SO-DIMM, Up to 64 GB (Un-buffered and Non-ECC)
      Graphics．Integrated Intel® HD Graphics
       ．Three Independent Display
      AudioRealtek ALC888-GR, High Definition Audio
      BIOSAMI 16 Mbit SPI BIOS
      I/O InterfaceDVI1x DVI-I connector, Up to 1920x1080@60Hz
      DP2x DP connector, Up to 3840 x 2160
      LAN
      2x 10/100/1000 Mbps, RJ45
       GbE1: Intel I219-LM
       GbE2: Intel I210
       Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE
       Optional Module
       ．4x 10/100/1000 Mbps, RJ45 Port
       ．4x 10/100/1000 Mbps, M12 Port
      PoE+Optional Module
       ．4x PoE+, Individual port 25.5W, RJ45 Port
       ．4x PoE+, Individual port 25.5W, M12 Port
      Serial Port2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9
       Optional Module
       ．4x RS-232/422/485, DB9 Connector
       ．4x Electrical Isolated RS-232/422/485, DB9 Connector
      USB．6x USB 3.0, Type-A
       ．2x USB 2.0, Type-A
      PS/2 Port1x PS/2, 6-pin mini-DIN Female Connector
      Isolated DIOOptional Module
       ．8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block
      Line-Out1x Line-Out, Phone Jack 3.5mm
      Mic-In1x Mic-In, Phone Jack 3.5mm
      Power Button1x ATX Power On/Off Button
      AT/ATX Switch1x AT/ATX Mode Switch
      Clear CMOS Switch1x Clear CMOS Switch
      Remote Power On/Off Connector1x Remote Power On/Off Connector, 2-pin Terminal Block
      Remote Reset Connector1x Remote Reset Connector, 2-pin Terminal Block
      External FAN Connector1x External FAN Connector, 4-pin Terminal Block
      StorageSSD/HDD2x 2.5" SATA HDD/SSD bay (Gen3)
       One Internal, One Front Accessable
       Support RAID 0/1, Hot Swap
      mSATA3x mSATA (Shared by Mini-PCIe Socket) (Gen3)
      ExpansionPCI/ PCIe2x PCI/PCIe Expansion slots
       Optional Riser Card
       ．1x PCIex16, 1x PCIex1
       ．2x PCIex8
       ．1x PCIex16, 1x PCI
       ．2x PCI
      CFM (Control Function Module) Interface1x CFM Interface for CFM Modules
      CMI (Combine Multiple I/O) Interface2x CMI Interface for CMI Modules
      Mini PCI Express3x Full-size Mini PCIe
       Supports Wireless &  I/O Expansion
      Universal I/O Bracket3x Universal I/O Bracket
      SIM Socket1x SIM Socket
      Antenna Holes2x Antenna Holes
      OtherInstant RebootSupport 0.2sec
      Power Ignition SensingOptional Module
       ．CFM with Delay Time Management and Selectable 12V/24V, Dip Switch
      SuperCapSuperCap integrated for CMOS Battery Maintenance-free Operation
      Watchdog TimerSoftware Programmable Supports 256 Levels System Reset
      Power RequirementPower TypeAT/ATX
      Power Input Voltage9~48VDC
      Connector3-pin Terminal Block
      Power AdapterOptional AC/DC Adapter
       ．AC/DC 24V/5A, 120W
       ．AC/DC 24V/9.2A, 220W
      PhysicalDimension (WxDxH)227 x 261 x 128 mm
      Weight Information5.7 kg
      Mechanical ConstructionExtruded Aluminum with Heavy Duty Metal
      MountingWall
      Unibody DesignYes
      Fanless DesignYes
      Jumper-less DesignYes
      ProtectionReverse Power Input ProtectionYes
      Over Voltage ProtectionProtection Range: 51~58V
       Protection Type: shut down operating voltage, re-power on at the preset level to recover
      Over Current Protection15A
      ESD Protection+/-8kV (air), +/-4kV (contact)
      Surge3.84 kV (impedance 12 ohm 1.2/50us waveform)
      Operating SystemWindows- 7th Generation Intel® CPU (Kaby Lake-S): Windows® 10
       - 6th Generation Intel® CPU (Skylake-S): Windows® 10/ 8.1/ 7
      LinuxSupports by project
      EnvironmentOperating Temperature7th Generation Intel® CPU (Kaby Lake-S)
       - 35W TDP CPU: -40°C to 50°C
       - 51W~65W TDP CPU: -40°C to 45°C
       6th Generation Intel® CPU (Skylake-S)
       - 35W TDP CPU: -40°C to 70°C
       - 51~65W TDP CPU: -40°C to 50°C
       (With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
      Storage Temperature-40°C to 85°C
      Relative Humidity70°C @ 95% RH (non-Condensing)
      ShockOperating, 50 Grms, Half-sine 11 ms Duration
       (w/ SSD, according to IEC60068-2-27)
      VibrationOperating, 5 Grms, 5-500 Hz, 3 Axes
       (w/ SSD, according to IEC60068-2-64)
      CertificationEMCCE,  FCC Class A, EN50121-3-2, E-Mark (E13, No. 10R-0514229)
      SafetyLVD EN62368-1
      
            
      
        
      
        
      
      
      
      
    
      
  
      
  
      
        
      

		 







  
    
    				
			 
    
    

    

     
      
     
	 

 	
	
	


      
	
      
		
      
			
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