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      您現(xiàn)在的位置： 德承（深圳）科技有限公司>>強固型嵌入式電腦>>*性能可擴展型 (DS系列)>> DS-1101強固型嵌入式電腦
      
  
      
      
      
          
      
              
              
      
                    
        
                      
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      DS-1101強固型嵌入式電腦
      
       	
            
			
      
                				    
      
					
      
						
                                                   
      
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                                    強固型嵌入式電腦
      
                                  
                  
      
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            DS-1101第7/6代Intel® Core™ i3 / i5 / i7 處理器， 高性能，擴展型和模塊化的強固型嵌入式系統(tǒng)，帶1個PCI/PCIe 擴展槽產(chǎn)品特點支持第7/6代Intel® Xeon®和Core™  i3 / i5 / i7 處理器（LGA1151） 2個DDR4 SO-DIMM 內(nèi)存插槽，支持2133MHz 64 GB 三重獨立顯示 （1個DVI-I, 2個DP） 1個2.5......
            
      
                            
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       德承DS-1101是一款高性能的無風扇嵌入式計算機，采用7/6代Intel®Core™平臺，支持多種臺式機CPU（LGA1151） ，支持兩個DDR4內(nèi)存插槽，可達64GB，使DS-1101能夠滿足各種計算需求。DS-1101具有豐富的I/O接口、串口供電、電隔離串口、光隔離數(shù)字I/O、多網(wǎng)口、網(wǎng)口供電（POE）、M12接口、RAID 0/1、智能點火控制和0.2秒即時重啟等功能。
       
       由于德承的CMI和CFM技術，您可根據(jù)具體需要使用我們現(xiàn)成的模塊配置專屬的DS-1101。此外，還支持1個PCI/PCIe擴展槽，具有不同的接口組合，用于擴展各種應用的擴展卡。DS-1101是一款堅固耐用的嵌入式系統(tǒng)，具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強（5G/50G），高標準的工業(yè)保護，具有超級電容可免維護長效運行等特點。DS-1101適用于惡劣環(huán)境和關鍵應用場合的部署，無需現(xiàn)場人員的維護。
      詳細規(guī)格
      Model NameDS-1101
      SystemProcessor? 7th Generation Intel® CPU (Kaby Lake-S)
       - Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP)
       - Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP)
       - Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP)
       - Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP)
       - Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP)
       - Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP)
       - Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP)
       ? 6th Generation Intel® CPU (Skylake-S)
       - Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP)
       - Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP)
       - Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP)
       - Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP)
       - Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP)
       - Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP)
       - Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP)
       - Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP)
       - Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP)
       - Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP)
      ChipsetIntel Q170
      Memory2x DDR4 2133 MHz SO-DIMM, Up to 64 GB (Un-buffered and Non-ECC)
      Graphics．Integrated Intel® HD Graphics
       ．Three Independent Display
      AudioRealtek ALC888-GR, High Definition Audio
      BIOSAMI 16 Mbit SPI BIOS
      I/O InterfaceDVI1x DVI-I connector, Up to 1920x1080@60Hz
      DP2x DP connector, Up to 3840 x 2160
      LAN
      2x 10/100/1000 Mbps, RJ45
       GbE1: Intel I219-LM
       GbE2: Intel I210
       Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE
       Optional Module
       ．4x 10/100/1000 Mbps, RJ45 Port
       ．4x 10/100/1000 Mbps, M12 Port
      PoE+Optional Module
       ．4x PoE+, Individual port 25.5W, RJ45 Port
       ．4x PoE+, Individual port 25.5W, M12 Port
      Serial Port2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9
       Optional Module
       ．4x RS-232/422/485, DB9 Connector
       ．4x Electrical Isolated RS-232/422/485, DB9 Connector
      USB．6x USB 3.0, Type-A
       ．2x USB 2.0, Type-A
      PS/2 Port1x PS/2, 6-pin mini-DIN Female Connector
      Isolated DIOOptional Module
       ．8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block
      Line-Out1x Line-Out, Phone Jack 3.5mm
      Mic-In1x Mic-In, Phone Jack 3.5mm
      Power Button1x ATX Power On/Off Button
      AT/ATX Switch1x AT/ATX Mode Switch
      Clear CMOS Switch1x Clear CMOS Switch
      Remote Power On/Off Connector1x Remote Power On/Off Connector, 2-pin Terminal Block
      Remote Reset Connector1x Remote Reset Connector, 2-pin Terminal Block
      External FAN Connector1x External FAN Connector, 4-pin Terminal Block
      StorageSSD/HDD2x 2.5" SATA HDD/SSD bay (Gen3)
       One Internal, One Front Accessable
       Support RAID 0/1, Hot Swap
      mSATA3x mSATA (Shared by Mini-PCIe Socket) (Gen3)
      ExpansionPCI/ PCIe1x PCI/PCIe Expansion slot
       
       Optional Riser Card
       ．1x PCIex16
       ．1x PCI
      CFM (Control Function Module) Interface1x CFM Interface for CFM Modules
      CMI (Combine Multiple I/O) Interface2x CMI Interface for CMI Modules
      Mini PCI Express3x Full-size Mini PCIe
       Supports Wireless &  I/O Expansion
      Universal I/O Bracket2x Universal I/O Bracket
      SIM Socket1x SIM Socket
      Antenna Holes2x Antenna Holes
      OtherInstant RebootSupport 0.2sec
      Power Ignition SensingOptional Module
       ．CFM with Delay Time Management and Selectable 12V/24V, Dip Switch
      SuperCapSuperCap integrated for CMOS Battery Maintenance-free Operation
      Watchdog TimerSoftware Programmable Supports 256 Levels System Reset
      Power RequirementPower TypeAT/ATX
      Power Input Voltage9~48VDC
      Connector3-pin Terminal Block
      Power AdapterOptional AC/DC Adapter
       ．AC/DC 24V/5A, 120W
       ．AC/DC 24V/9.2A, 220W
      PhysicalDimension (WxDxH)227 x 261 x 108 mm
      Weight Information5.22 kg
      Mechanical ConstructionExtruded Aluminum with Heavy Duty Metal
      MountingWall
      Unibody DesignYes
      Fanless DesignYes
      Jumper-less DesignYes
      ProtectionReverse Power Input ProtectionYes
      Over Voltage ProtectionProtection Range: 51~58V
       Protection Type: shut down operating voltage, re-power on at the preset level to recover
      Over Current Protection15A
      ESD Protection+/-8kV (air), +/-4kV (contact)
      Surge3.84 kV (impedance 12 ohm 1.2/50us waveform)
      Operating StystemWindows- 7th Generation Intel® CPU (Kaby Lake-S): Windows® 10
       - 6th Generation Intel® CPU (Skylake-S): Windows® 10/ 8.1/ 7
      LinuxSupports by project
      EnvironmentOperating Temperature7th Generation Intel® CPU (Kaby Lake-S)
       - 35W TDP CPU: -40°C to 50°C
       - 51W~65W TDP CPU: -40°C to 45°C
       6th Generation Intel® CPU (Skylake-S)
       - 35W TDP CPU: -40°C to 70°C
       - 51~65W TDP CPU: -40°C to 50°C
       (With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
      Storage Temperature-40°C to 85°C
      Relative Humidity70°C @ 95% RH (non-Condensing)
      ShockOperating, 50 Grms, Half-sine 11 ms Duration
       (w/ SSD, according to IEC60068-2-27)
      VibrationOperating, 5 Grms, 5-500 Hz, 3 Axes
       (w/ SSD, according to IEC60068-2-64)
      CertificationEMCCE,  FCC Class A, EN50121-3-2, E-Mark (E13, No. 10R-0514229)
      SafetyLVD EN62368-1
        
        
      
            
      
        
      
        
      
      
      
      
    
      
  
      
  
      
        
      

		 







  
    
    				
			 
    
    

    

     
      
     
	 

 	
	
	


      
	
      
		
      
			
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