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- 9 front slots to host either: Advantech MIC-8303C Dual Node In® Xeon® Processor D-1500 SoC (D-8 or D-16) compute blades, Advantech MIC-8302C Single Node In® Xeon® Processor E5-2600 v3 compute blades or Advantech MIC-8304C Single Node In® Xeon® Processor D-1500 SoC (D-8 or D-16) (Cloud controller node)
- 9 slot mid-plane providing dual star connectivity between switch boards and blades. Each fabric and star network supports dual GbE control/management ports per slot and dual 10GbE data fabric ports per compute slot
- 2 x ESP-9002C Switch/Management Modules integrating Broadcom Trident+ BCM56842 data plane switch and Broadcom BCM53346 GbE control plane / management switch
- System I/O per switch blade: 10 x SFP+ (10G-SR, -LR, -ER) data fabric interfaces, 2 x SFP+ control fabric interfaces, 2 x RJ45 GbE Management ports, 1 x RJ45 console, and 2 x USB
- Up to 2 x 2.5” hot-swappable HDD trays for SATA disks / SSD per switch blade as integrated system NAS (optional)
- 4 hot swappable fan modules with a total of eight 9238-type high speed fans
- 2+2 redundant AC/DC power supply scheme
- Shelf management based on Advantech IPMI
The Packetarium XLc is a fully carrier-grade blade server designed for the virtual network infrastructure (NFVI). It is the first co-grade server of its class to bring Virtual Network Functions out to the edge of the network enabling applications such as Edge Computing and Cloud RAN. The PAC-6009 combines high-end networking with IT design principles to accommodate the maximum density of compute available in a 400mm deep 6U chassis, yet meet demanding industry standards with NEBS-3 compliance. Its scale-out design hosts up to 9 In® Xeon® Processor E5 or In® Xeon® Processor D-1500-based blades for demanding NFV workloads. The system’s 400W per RU power footprint fits industry standard 19”racks and lowers total cost of ownership in more efficient network deployments. The Packetarium XLc seamlessly integrates with industry standard software frameworks to accelerate the roll-out of next-generation NFV solutions.
晶創(chuàng)越世科技(北京)有限公司主營:研祥加固全系列,研祥工控機(jī),研祥CPCI機(jī)箱,研祥CPCI主板,研祥加固筆記本,研祥平板電腦,研祥嵌入式工控機(jī),研祥顯示器,研祥加固顯示器,研祥工業(yè)顯示器,三菱液晶屏,三菱陽光下可視液晶屏,三菱LED背光液晶屏,三菱寬溫液晶屏,研華工控機(jī),研華ADAM模塊,研華一體化工作站,研華板卡,研華采集卡,研華便攜式工控機(jī),研祥工控機(jī),研華嵌入式工控機(jī),研華無風(fēng)扇工控機(jī),松下加固筆記本全系列,GETAC加固筆記本,Gcreat工控機(jī)全系列,Gcreat嵌入式無風(fēng)扇工控機(jī),Gcreat平板電腦,Gcreat一體化工作站,Gcreat工業(yè)顯示器。
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2025第十一屆中國國際機(jī)電產(chǎn)品交易會(huì) 暨先進(jìn)制造業(yè)博覽會(huì)
展會(huì)城市:合肥市展會(huì)時(shí)間:2025-09-20