全自動雙X/Y平臺玻璃切割機

Automatic Cutting Machine

產(chǎn)品簡介：

采用紅外皮秒激光器，保證光束質(zhì)量，光斑細(xì)，切割精度高。

IR picosecond laser is used to ensure perfect beam quality, fine spot and high cutting precision

產(chǎn)品亮點：

兼容多款國內(nèi)外激光器型號，可添加CCD定位等功能模塊

Compatible with a variety of domestic and overseas laser models

Optional customized CCD solution and other functional modules can be added

高速XY運動平臺，大程度提升加工速度

High speed XY platform ensures stability under high speed processing

采用雙工作臺，進(jìn)行高效切割，增加加工范圍，滿足定制化大尺寸激光開料

Double work station for efficient cutting

Increase the processing range to realize the customized large-size laser cutting

實現(xiàn)無錐度切割，邊緣光滑，崩邊少

Realize no taper cutting, smooth edge and minimized chipping

性能參數(shù)：

應(yīng)用領(lǐng)域：

光學(xué)玻璃、強化玻璃、素玻璃、毛玻璃、超薄玻璃、藍(lán)寶石，手機面板、手表蓋板、車載面板、平板電腦面板、玻璃存儲光盤、TFT-LCD、硅晶圓等脆性材 料切割與裂片

Optical glass, strengthened glass, plain glass, ground glass, ultra-thin glass, sapphire, phone panel, watch cover, vehicle panel, tablet computer panel, glass storage CD, TFT-LCD, silicon wafer and other brittle material filamentation and separation