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      IPC960A

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      更新時間:2023-04-12 12:26:33瀏覽次數:191次

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      IPC960A

      產品特點

      • Fanless embedded system
      • Optional extension system I/O window
      • Optional 5G network (Q670E)
      • USB power on/off control via BIOS setting
      • Intelligent power management - ACC ignition
      • EN 61000-6-2 certified
      • Supports Intel® RST
      CPU
      • 12th gen Intel® Core™ processor, up to 65W
      Chipset
      • Intel® H610E/Q670E
      System Memory
      • 2 x DDR5 4800/4000 SO-DIMM, up to 64GB
      BIOS
      • AMI
      COM
      • 1 x RS-232/422/485 (default RS-232)
      • More COM ports available from extension I/O modules
      USB
      • Intel® H610E:
      • 4 x USB 3.2 Gen2x1 (10G) type A
      • 2 x USB 2.0 Type A
      • Intel® Q670E:
      • 6 x USB 3.2 Gen2x1 (10G) type A
      • 1 x USB 2.0 (Q670E, internal,up to 30mm) 180D type A
      • More USB ports available from extension I/O modules
      Ethernet
      • 1 x 2.5GbE LAN (Intel® I226-LM)
      • 1 x RJ-45 GbE LAN (Intel® I219-LM) with Intel® AMT
      • More LAN ports available from extension I/O modules
      Display
      • 1 x DisplayPort++ with 4096 x 2304 resolution supported
      • 1 x HDMI with 4096 x 2304 resolution supported
      • 1 x DVI-D with 1920 x 1200 resolution supported
      Digital I/O
      • Available from extension I/O modules
      Audio
      • 1 x 3.5mm jack for Mic-in and Line-out
      Storage
      • Intel® H610E:
      • 2 x 2.5" HDD/SSD with Intel® RST supported (7/9.5/15 mm height)
      • Intel® Q670E:
      • 2 x 2.5" HDD/SSD with Intel® RST supported (7/9.5/15 mm height)
      • 1 x M.2 Key M 2280 socket (PCIe x4 Gen4)
      Expansion
      • Intel® H610E:
      • 1 x Full-size PCI Express Mini Card slot (USB & PCIe interface) with SIM slot
      • 1 x M.2 Key E 2230 socket (optional)
      • Intel® Q670E:
      • 1 x Full-size PCI Express Mini Card slot (USB & PCIe interface) with SIM slot
      • 1 x M.2 Key E 2230 socket + 1 x M.2 Key B 3042/3050/3052/3060 socket w/SIM slot for 5G module or selected LTE module (optional)
      Others
      • TPM 2.0
      • 1 x HDD/SSD access LED
      • 3 x User's LED
      • 1 x Switch for power on/off with LED (default ATX)
      Power
      • Input: 18 to 36 VDC
      • 1 x Switch for power on/off with LED (default ATX)
      • 1 x 4-pin terminal block (5.08 mm) for DC input
      • 1 x 4-pin terminal block (5.08 mm) for ignition control, remote power and remote LED
      Construction
      • Aluminum extrusion heavy-duty cold-rolled steel
      Operating Temperature
      • -20°C to +70°C (-4°F to +158°F)with 12th gen Intel® Core™ processor and W.T. HDD/SSD
      Relative Humidity
      • 10% to 90%, non-condensing
      Dimensions
      (W x H x D)
      • 83.5 x 192 x 260 mm (3.29" x 3.62" x 10.24")
      Weight (net/gross)
      • 4.2 kg (9.26 lb)/5.2 kg (11.46 lb)
      Software Support
      • AXView
      EOS Support
      • Windows® 10, Linux
      Certifications
      • CE (EN 61000-6-4/EN 61000-6-2)/FCC

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