具體成交價以合同協(xié)議為準
MIC-6313 PreliminaryOpenVPX CPU Blade with Intel® 4th/ 5th G
￥面議
北京元大興業(yè)科技有限公司
免費會員您現(xiàn)在的位置： 北京元大興業(yè)科技有限公司>>工業(yè)計算機系統(tǒng)>>Cpci總線工業(yè)電腦>> MIC-6313 PreliminaryOpenVPX CPU Blade with Intel® 4th/ 5th G
產品簡介
產品介紹
- 5th Generation Intel® Core® processor, up to 4 cores / 8 threads
- Intel® QM87 PCH
- Triple independent display support
- OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-2 profile compliant
- Onboard and SO-DIMM DDR3L-1600, up to 16 GB, with ECC support
- Four SRIOx4 ports and two PCIex8 ports on Fabric interface
- Four 1000BASE-T ports on Base interface (two configurable to SERDES)
- Two 1000BASE-T front panel ports
- One CFast and one onboard flash storage device
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance.
Tailored for rugged environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller.
Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demａnd for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
Tailored for rugged environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller.
Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demａnd for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
