設(shè)備名稱:CCD線路板曝光機 Machine Name:Automatic imaging alignment Exposure machine(for inner& outer layer) | |
技術(shù)參數(shù) Specifications | |
制程應(yīng)用 Process application | 內(nèi)/外層全自動對位曝光制程 For PCB inner& outer layer |
電路板尺寸 PCB size | 254mm×254mm(10”×10”) 540mm×620mm(21”×24”) |
電路板厚度 PCB thickness | 0.1mm~3.5mm (含銅厚contains copper) |
底片尺寸 a/w size | 660mm×762mm(26”×30”) |
板厚公差thickness tol. | ±75mm |
設(shè)備尺寸 Machine size | L2570**W1440*H2020mm |
設(shè)備重量 Machine weight | about 2100kg |
設(shè)備說明/Introduction: CCD線路板曝光機適用于PCB內(nèi)外層制程(For inner &outer layer) ·4CCD對位系統(tǒng)(4CCD auto alignment system) ·UVLED點陣式平行光源(UVLED collimated light) ·高解析度50um/50um(Hight resolution 50um/50um) ·超低用電能耗每小時約3度(Ultra low power consumption is about 3 degrees per hour.) |