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DX-1200 是款無風(fēng)扇嵌入式電腦，在其緊湊體積下充分將效能與強固發(fā)揮到。由于這些出色的特性，DX-1200 成為了智能制造、機器視覺和邊緣 AI 應(yīng)用的理想選擇。DX-1200 在效能上可搭載 Intel® 第 12 代 Alder Lake-S Core™ 處理器（TDP 高達 65 W）及 DDR5 4800 MHz 內(nèi)存，展現(xiàn)了高速流暢的運算效能。在功能方面，憑借豐富的原生 I/O 及模塊化擴展設(shè)計，可以有效且實時地滿足多元化的應(yīng)用需求。
Product Category >>>> Rugged Embedded Fanless PC
的 運算效能
——
DX-1200 可搭載 Intel® 7 制程的第 12 代 Core™ i9/i7/i5/i3（Alder Lake-S）處理器，可擁有高達 16 核心（8P + 8E）及 24 線程的配置，處理效能是 Comet Lake-S 的 1.35 倍以上。此外，透過 Intel® Xe 架構(gòu)的 UHD 770 顯示芯片，在 GPU 圖像分類推理效能則是 Comet Lake-S 的 2.8 倍，非常適用于 AI 和多種邊緣運算應(yīng)用，展現(xiàn)的處理效能。
高速、安全兼?zhèn)涞?內(nèi)存
——
兩組 DDR5 SO-DIMM 插槽可支持高達 64GB 4800 MHz 內(nèi)存。此外，還支持內(nèi)存 ECC 錯誤修正技術(shù)（Error Correction Code），對于穩(wěn)定性和可靠度要求的工控領(lǐng)域至關(guān)重要。
豐富、多元的 擴展性
——
因應(yīng)廣泛的工業(yè)應(yīng)用需求，DX-1200 提供了 1x M.2 Key E 插槽和 2x Mini PCIe 插槽，除了支持的無線傳輸方式，如 WiFi、GNSS、4G 和藍牙外，還可透過 Mini PCIe 擴展槽安裝所需的 I/O 擴展卡、影像擷取卡等，以滿足不同的應(yīng)用需求。
高速、可靠的 數(shù)據(jù)傳輸
——
為了有效提高視頻或大型檔案的傳輸效率，DX-1200 配備最多 4 個高速 10Gbps LAN。而面對多個網(wǎng)絡(luò)設(shè)備的應(yīng)用環(huán)境需求，則提供最多 8x PoE，可以通過同一線纜提供數(shù)據(jù)和電力，有效降低了布線的難度。
強固設(shè)計 穩(wěn)健可靠
——
DX-1200 的強固性可從其工業(yè)級保護設(shè)計及不同領(lǐng)域行業(yè)認證中體現(xiàn)。除了寬溫（-40 ~ 70°C）、寬電壓（9 - 48 VDC）、過電壓、過電流和靜電保護（ESD）等特點，還符合軍規(guī)沖擊震動標(biāo)準(zhǔn) MIL-STD-810G。此外，為確保產(chǎn)品的安全可靠，也獲得廣泛認可的 UL 62368-1 安全認證。為提供更安心的軌道交通解決方案，還通過 EN 50155 中的電磁兼容（EMC）EN 50121-3-2 標(biāo)準(zhǔn)以及 EN 45545-2 防火標(biāo)準(zhǔn)。
| Model Name | DX-1200 | |
|---|---|---|
| System | Processor | 12th Generation Intel® Alder Lake-S Series CPU: - Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W - Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W - Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W - Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W - Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W - Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W - Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W - Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W - Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W - Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W - Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W - Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
| Chipset | Intel R680E Chipset | |
| Memory | 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64GB | |
| BIOS | AMI BIOS | |
| Graphics | Graphics Engine | Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 Integrated Intel® UHD Graphics 730: Core™ i3 Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Maximum Display Output | Supports Quad Independent Display | |
| DVI | 1x DVI-I Connector - VGA: 1920 x 1080 @ 60 Hz - DVI-D: 1920 x 1200 @ 60 Hz | |
| DP | 1x DP Connector: 4096 x 2304 @ 60Hz * Verified maximum resolution: 3840 x 2160 @ 60Hz | |
| HDMI | 1 x HDMI Connector (3840x2160@30Hz) | |
| Audio | Audio Codec | Realtek® ALC888, High Definition Audio |
| Line-out | 1x Line-out, Phone Jack 3.5mm | |
| Mic-in | 1x Mic-in, Phone Jack 3.5mm | |
| I/O | LAN | 2x 1GbE LAN, RJ45(Supports Wake on LAN, PXE) - GbE1: Intel® I219 - GbE2: Intel® I210 |
| COM | 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |
| USB | 4x 10Gbps USB 3.2 Gen2, Type A 4x 5Gbps USB 3.2 Gen1, Type A | |
| Storage | SSD/HDD | 2x 2.5" SATA HDD/SSD Bay (SATA 3.0) |
| mSATA | 2x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket ) | |
| RAID | Support RAID 0/1/5/10 | |
| Expansion | Mini PCI Express | 2x Full-size Mini-PCIe Socket |
| M.2 E Key Socket | 1x M.2 Key E Type 2230 Socket, Support Intel CNVi Module | |
| SIM Socket | 1x SIM Socket | |
| CMI (Combined Multiple I/O) Interface | 2x High Speed CMI Interface for optional CMI Module Expansion 1x Low Speed CMI Interface for optional CMI Module Expansion | |
| CFM (Control Function Module) Interface | 1x CFM IGN Interface for optional CFM-IGN Module Expansion | |
| Other Function | External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
| Clear CMOS Switch | 1x Clear CMOS Switch | |
| Reset Button | 1x Reset Button | |
| Instant Reboot | Support 0.2sec Instant Reboot Technology | |
| Watchdog Timer | Software Programmable Supports 256 Levels System Reset | |
| Power | Power Button | 1 x ATX Power On/Off Button |
| Power Mode Switch | 1 x AT/ATX Mode Switch | |
| Power Input | 9 - 48VDC, 3-pin Terminal Block | |
| Remote Power On/Off | 1 x Remote Power On/Off, 2-pin Terminal Block | |
| Physical | Dimension ( W x D x H ) | 242 x 173 x 75 mm |
| Weight Information | 3.05 kg | |
| Mechanical Construction | Extruded Aluminum with Heavy Duty Metal | |
| Mounting | Wall / DIN-RAIL / VESA / Side Mount | |
| Physical Design | ? Fanless Design ? Cableless Design ? Jumper-less Design ? Unibody Design | |
| Reliability & Protection | Reverse Power Input Protection | Yes |
| Over Voltage Protection | ? Protection Range: 51~58V ? Protection Type: shut down operating voltage, re-power on at the preset level to recover | |
| Over Current Protection | 15A | |
| CMOS Battery Backup | SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| MTBF | 394,488 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3 | |
| Operating System | Windows | Windows® 10 |
| Linux | Supports by project | |
| Environment | Operating Temperature | ? 35W TDP Processor: -40°C to 70°C ? 65W TDP Processor: -40°C to 50°C (With External Fan Kit) - With extended temperature peripherals; Ambient with air flow - According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C to 85°C | |
| Relative Humidity | 95% RH @ 70°C (Non-condensing) | |
| Shock | MIL-STD-810G | |
| Vibration | MIL-STD-810G | |
| EMC | ? CE, UKCA, FCC, ICES-003 Class A ? EN 50155 (EN 50121-3-2 Only) ? E-Mark (Pending) | |
| Safety | UL, cUL, CB, IEC/EN 62368-1 (Pending) | |
| Fire Protection | EN 45545-2 | |
