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      IPC964-512-FL嵌入式系統(tǒng)與網(wǎng)絡(luò)安全平臺

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      產(chǎn)品簡介

      產(chǎn)品特點LGA1151Socket7th/6thgenIntelCore™i7/i5/i3processor

      詳細介紹

      產(chǎn)品特點

      • LGA1151 Socket 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor, up to 65W (codename: Kaby Lake/Skylake)
      • Intel® Q170 chipset
      • Supports 4 expansion slots
      • Power input: 24 VCD (uMin=19V/uMax=30V)
      • Compact & front I/O design
      • -10°C to +60°C operating temperature range
      • Supports 2 swappable 2.5" HDD & RAID 0,1
      • Supports ECM BIOS setting
      • Supports WLAN module & antenna (optional)
      • Supports TPM 2.0

      產(chǎn)品介紹

      The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.

      CPU
      • 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor up to 65W (Kaby Lake/Skylake)
      Chipset
      • Intel® Q170
      System Memory
      • 2 x DDR4-2133/2400 un-buffered SO-DIMM, up to 32GB
      BIOS
      • AMI
      COM
      • Available from extension I/O modules
      USB
      • 4 x USB 3.0
      • More USB ports available from extension I/O modules
      Ethernet
      • 2 x 10/100/1000 Mbps (Intel® i211-AT)
      • More LAN ports available from extension I/O modules
      Display
      • 1 x HDMI
      • 1 x VGA
      Digital I/O
      • Available from extension I/O modules
      Audio
      • 1 x Audio (Mic-in/Line-out)
      Storage
      • 2 x 2.5" swappable HDD (15mm height)
      Expansion
      • AX96410: 1 PCIe x16 + 3 PCIe x4
      • AX96411: 1 PCIe x16 + 1 PCIe x4 + 2 PCI
      • 1 x Full-size PCI Express Mini Card slot with SIM slot (USB & PCIe interface)
      • 1 x I/O module slot
      Others
      • Extension IO Modules:
        AX93511: 4 x RS-232/422/485 module (default RS-232)
        AX93512: 2 x RS-232/422/485 with isolated 1.5KVDC & 8-in/8-out with isolated 1.5KVDC DIO module
        AX93516: 4 x RS-232/422/485 with isolated 2KVDC module
        AX93519: 1 x 10/100/1000 Mbps (Intel® i211-AT) Ethernet, 2 x RS-232/422/485 and 2 x USB 3.0 module
      Power
      • Type: ATX/AT
      • Input: 24 VDC (uMin=19V/uMax=30V)
      Construction
      • Aluminum extrusion heavy-duty cold-rolled steel
      Operating Temperature
      • -10°C to +60°C (+14°F to +140°F) with 6th gen Intel® Core™ up to 35W and W.T. HDD/SSD
      • -10°C to +50°C (+14°F to +122°F) with 6th/7th gen Intel® Core™ up to 65W and W.T. HDD/SSD
      Relative Humidity
      • 10% to 90%, non-condensing
      Dimensions
      (W x H x D)
      • 188.1 x 192 x 230 mm (7.39" x 7.54" x 9.04")
      Weight (net/gross)
      • 4.8 Kg (10.56 lb) /5.9 Kg (12.98 lb)
      Software Support
      • AMS.AXView
      Certifications
      • CE, FCC; CCC (refer to ordering information)


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