MSA-600顯微激光測(cè)振儀

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MSA-600顯微激光測(cè)振儀基于MEMS系統(tǒng)的一體化光學(xué)測(cè)量解決方案基于MEMS系統(tǒng)的MSA-600顯微式激光測(cè)振儀，集多種測(cè)量功能于一體，其不僅能測(cè)量面內(nèi)振動(dòng)和面外振動(dòng)，還能測(cè)量表面形貌。系統(tǒng)具有的靈活性和精度，以滿足顯微結(jié)構(gòu)未來(lái)的發(fā)展需要。顯微式激光測(cè)振儀可提供精確的三維動(dòng)態(tài)和靜態(tài)響應(yīng)數(shù)據(jù)，在降低開發(fā)和制造成本的同時(shí)提高產(chǎn)品性能，從而縮短設(shè)計(jì)周期，簡(jiǎn)化故障處理，提高產(chǎn)品產(chǎn)量......

詳細(xì)介紹

The Micro System Analyzer is the premier measurement tool for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS. By fully integrating a microscope with scanning laser doppler vibrometry, stroboscopic video microscopy and scanning white light interferometry, the Micro System Analyzer is designed with an all-in-one combination of technologies that clarifies real microstructural response and topography.

SYSTEM:

Optical Unit

The MSA Optical Unit is offered in six configurations that allow individual or combined in-plane measurements, out-of-plane measurements or topography measurements. Depending on system type, the optical unit comprises the head with microscope optics as well as a single-point or differential fiber optic interferometer. In all configurations, the Sensor Head has optimized microscope optics, an integrated LED illumination unit and a progressive scan video camera which provides a live video stream for the Data Management System.

Processing Unit

The Processing Unit comprises the Data Management System with MSA Software, the Junction Box and, in system configurations that include vibrometry, the Vibrometer Controller.

Software

The Software comprises the different programs for data acquisition and evaluation:
?Scanning Vibrometer software for out-of-plane measurements offers quick and easy set up, simple data acquisition and outstanding 3D data visualization.
?Planar Motion Analysis software similarly controls the in-plane measurement process and provides a dynamic visualization.
?Topography Measurement System Software for data acquisition, analysis, 2D and 3D data representation, including profile cuts.

Configurations

The Micro System Analyzer can be configured to cover many operating modes and measurement ranges needed to characterize microstructures. The following table helps to match the appropriate system to the application. we provides systems for either single-task or combined measurements. For out-of-plane vibration measurements, the system can be configured for either single-beam or differential operation. Differential systems can perform both single-beam and differential measurements. In addition to the standard 1.5 MHz version, there is a 24 MHz option that features both high-frequency data acquisition and a high-frequency waveform generator.

FEATURES:

Award-Winning Micro System Analyzer

Incorporated in the MEMS design and test cycle, we provides precise 3D dynamic and static response data that simplifies troubleshooting, enhances and shortens design cycles, improves yield and performance, and reduces product cost. This outstanding degree of innovation has been recognized by two prestigious awards: the 2005 Sensor Innovation Award and the Photonics Circle of Excellence for the development of microscope-based scanning vibrometry.

Superior Dynamic Characterization Compared to Single Technology Solutions

The combination of two complementary measurement techniques for investigating the vibrational behavior of small structures provides superior performance. For example, it can quickly identify, visualize and measure system resonances and transient responses, enhancing overall measurement productivity. This improved efficiency is especially important when integrating the measurement system into automated processes for MEMS production environments. Single-technology solutions like ESPI, white light interferometry, and phase-shifting interferometry give a much more limited view of small structure response.

Finds All Mechanical Resonances Without Prior Information

Using wide-bａnd excitation, the highly sensitive laser-Doppler technique can rapidly find all mechanical resonances (in-plane and out-of-plane) without prior information. In a second step, stroboscopic video microscopy is used to obtain accurate amplitude and phase information of in-plane resonances identified through laser vibrometry.

BENEFITS:

The All-in-One Solution - Superior Integration of Technologies
?Rapid identification and visualization of both system resonances and static topography
?Integrated microscope optics with optimized optical path for best lateral resolution and highest image quality
?Easy integration with MEMS/wafer probe stations
?Simple and intuitive operation, ready to measure within minutes
?Increased productivity through short measurement cycle
?Accelerates product development, troubleshooting and time-to-market

Scanning Laser-Doppler Vibrometry for the Measurement of Out-of-Plane Vibrations
?Full-field vibration mapping and broadband, out-of-plane frequency response information
?Displays frequency-domain and time-domain data, simplifying transient response analysis
?High-density sample grids with up to 512 x 512 user-defined measurement points
?Versatile data import and export interfaces to validate FE models
?Submicron laser spot for measuring very small structures and details
?Laser dimmer for optimized measurement conditions

Stroboscopic Video Microscopy for In-Plane Motion Detection
?Stroboscopic video measurement of in-plane motion with frequencies up to 1 MHz
?Time-domain displacement measurements with nanometer resolution
?Integrated signal generator for step-response, ring-down and Bode plot measurements
?Time-saving, automatic multibａnd processing

White Light Interferometry for the Acquisition of Topography Data
?Rapid, non-contact 3D topography measurement with subnanometer resolution
?Determination of structure heights and shape on both rough and specular surfaces
?Overlay technique copes with different contrast levels and material mixes
?Powerful TMS software for topography and surface characterization

?2D and 3D presentation with video overlay

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